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“ASM IHAWK Wire Bonder – used semiconductor equipment” has been added to your cart.
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“ASM IHAWK Wire Bonder – used semiconductor equipment” has been added to your cart.
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DISCO DAD 3360 High Torque Dicing Saw
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Hitachi S9360 CD SEM Scanning Electron Microscope 300mm, parts system
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Hitachi S9360 CD SEM Scanning Electron Microscope 300mm
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BESI DATACON 2200 EVO Dual Head
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DISCO DGP 8761 System With automatic frame wafer thinning system
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Tel Synapse 3 tools: V Coater, V Bonder and Z Debonder
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ACCRETECH UF2000 probers, tri-temp
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DAGE XD7600 NT X-RAY
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Orthodyne 3700 PLUS Wire Bonder in Europe
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DATACON BESI 2200 EVO – Like New – Year 2012 Europe
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ESI 5335 Laser via drilling system for flex PCB manufacturing (2 sets)
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Leica INS 3300
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Tokyo Electron P12XLN
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Camtek Condor 103M Post Saw 2D inspection
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Camtek Condor PD 103M Post Saw 2D inspection
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Camtek Falcon 520 PD PLUS Automated Optical Inspection system
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Camtek Falcon 530 PD PLUS Automated Optical Inspection system
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K&S Iconn MEM Plus ELA
$
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ASM ASLI ICA1204 Laser Ablation
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TSK UF200A Wafer Probers 4 sets Working & 2 sets Parts-Systems
$
1.00
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Rudolph Technologies AXI 935D Macro Inspection System
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0.00
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K&S IConn Wire Bonders
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ACCRETECH UF300 Prober
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Accretech TSK UF200, Ambient – Hot
$
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Accretech TSK UF200, Ambient – Hot
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Accretech TSK UF200SA Tri-Temp
$
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Kla Prometrix RS55 tca
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Semicon China Equipment For Sale
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Feinfocus FXS 160.40 SGC
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Candela CS 20 series optical surface analyzer (OSA(x3)
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0.00
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TSK UF200S WAFER PROBER
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ASM IDEALmold R2R x 2
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TSK Accretech UF200R
$
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Orthodyne 7200 Wire Bonder
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Olympus MX51 Inspection Microscope
$
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Datacon 2200 Evo (2013 vintage)
$
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Datacon 2200 Evo Vintage 2012
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Datacon Evo 2200 2015 vintage
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Disco DFD 6361 Dicing saw
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Datacon 2200 Evo
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Orthodyne M360C Wedge Wire Heavy Wire Bonder
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0.00
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Orthodyne M7200 Dual Head Heavy Wire Bonder for sale
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Orthodyne M360C Heavy Wire Bonders For Sale
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TSK UF200 + TSK UF200S Wafer Probers September 2018
$
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TSK Accretech UF 3000 EXe
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