Orthodyne 3700 Plus Wire Bonder
small wire bonder
wire size : 25 – 75μm
in Europe – can be seen operational.
The 3700Plus is a high-accuracy, high-speed, small-wre bonder.
With a unique combination of Orthodyne’s latest digital U/S generator, high-frequency transducer technology, and the optional Bond Process Monitoring System (BPM), the 3700Plus provides a complete package to achieve consistent bond quality.
With its open design and large work area, the 3700Plus offers a versatile and flexible equipment solution. Following this design principle, the 3700Plus easily adapts from manual operation to fully automatic line integration.
The 3700Plus represents a new wire bonder platform that meets today’s advanced packaging challenges. Its technology delivers high productivity, process stability, low cost of ownership (COO) and the flexibility to grow with market demands.
Speed: The low-mass bondhead and unique XY table design combined with high performance linear motors and advanced motion control technology result in one of the most productive small wire wedge bonders on the market.
New Low Maintenance Bondhead: Features a modular design that is easy to set-up and maintain for higher uptime.
Enhanced PR System: Enhanced third generation system (GSIII) offers accuracy and repeatability through a variety of powerful tools for virtually every device.
Enhanced Calibration & Diagnostics: User-friendly calibration and diagnostics software simplifies troubleshooting and machine calibrations.
Software: A GUI-based software structure offers simplified and user-friendly machine operation and sophisticated troubleshooting tools for lower training cost and increased uptime.
Bond Process Monitoring (BPM): An optional BPM system monitors bond deformation and ultrasonic signal sample in real time. Suspect bonds are flagged and vital process information can be stored for evaluation.
High-frequency Low-Mass Transducer: The new Orthodyne 120kHz U/S system drives the Orthodyne miniature low mass transducer. The resulting low-impact force ensures high-quality interconnects.
Repeatable Tail Length: Modular tear and feed flat coil mechanism allows the user to program wire feed as well as clamp force, resulting in consistent tail length and tail control.
Ramp Bonding: The 3700Plus fully supports the Orthodyne ramp bonding technology used to provide a flexible process while improving yield for highly sensitive surfaces.
“Per Bond” Parameters: The 3700Plus software makes virtually every bond parameter programmable on a “per bond” level. This customization assures maximum flexibility and bond quality for the most advanced packages.
Programmable Force Control: The 3700Plus bondhead features Orthodyne’s third-generation programmable forcer. The improved accuracy and linearity throughout the bond force range ensures a consistent bond process.
Graphical Bondhead Setup (GBS): With the optional GBS system, bondhead consumables are adjusted to graphical templates for fast, accurate, and repeatable consumable replacement.
Networking: Simple Networking via Ethernet, USB, or Serial port. SECS/GEM is available as an option.
Open Machine Design & System Architecture: The completely open table design allows access from below the work area. Shuttle and clamping systems as well as line integration are simple and inexpensive. The table can be removed or replaced to make room for any customized clamping scheme.
Manual to Automatic: The 3700Plus can be loaded manually for prototyping or low volume production. When needed, automation and integration of the system is simple and inexpensive.
File Handling: CDRW, hard drive and networking provide easy-to-use tools for data transfer, data storage and program back-up.
Advanced Looping Algorithms: Constant loop length or height are just two of the many looping features available. Customized loop modes are available with Orthodyne’s Loop Development Tool (LDT).
Alternate Bondhead Configurations: 3700Plus is available with 45° and 60° wire feed bondheads