DATACON 2200 EVO
Vintage 2012 ( Available November 2019 in Europe)
In R&D Facility
Like new – Hardly Used
Comes with many extra spares
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.
Twin module , Station 1 dispense axis, Station 2 Pick and Place
This system has never seen mass production, has only been used for very short term R&D projects, and is in “like-new” condition. All spares shown in photos are included.
WeChat ID: CSISEMI