Tel Synapse V Coater, V Bonder and Z Debonder
3 tools in group discounted deal.
Synapse™ series became an industry standard Bonding/DeBonding tools for 300mm wafers, by combining TEL’s leading-edge technologies such as ultra-thin wafer transfer, chemical coating, plasma processing and cleaning developed over the 50 years of history. Synapse™ series provide advanced solutions for temporary Bonding/DeBonding process in TSV (Through Silicon Via), permanent bonding process for CMOS image sensor and other various types of devices to contribute to high volume manufacturing of 3D integration which becomes even more important and expected to grow.
See details here TEL Synapse Tools for Sale
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