| CSI Semi ID# |
Manufacturer |
Model |
Process |
comments |
| CSI0016540 |
Advantest Corporation |
T5761 |
Memory Tester |
|
| CSI0016541 |
Brooks Automation.Inc,. |
Ultrasort408 |
Auto Sorter |
|
| CSI0016542 |
Accent |
Q200i |
Overlay Measurement |
|
| CSI0016543 |
Accretech |
UF200SA |
|
|
| CSI0016544 |
Accretech |
UF200 |
|
|
| CSI0016545 |
Accretech |
UF3000 |
|
|
| CSI0016546 |
Accretech |
UF3000EX |
|
|
| CSI0016547 |
Accretech/TSK |
UF3000 |
Production Wafer Prober |
|
| CSI0016548 |
ADT |
7100 |
Dicing Saw |
|
| CSI0016549 |
ADVANTEST |
T2000 |
|
|
| CSI0016550 |
Advantest |
T5723 |
Memory Tester |
|
| CSI0016551 |
Advantest |
T5723ES |
Memory Tester |
|
| CSI0016552 |
Advantest |
T5383 |
Memory Tester |
|
| CSI0016553 |
Advantest |
T5585 |
Memory Tester |
|
| CSI0016554 |
Advantest |
M6542AD |
Pick & Place Memory Handler |
|
| CSI0016555 |
Advantest |
T5371 |
Memory Tester |
|
| CSI0016556 |
Advantest |
M6245 |
Pick & Place Memory Handler |
|
| CSI0016557 |
Advantest Corporation |
T5335 |
Memory Tester |
|
| CSI0016558 |
Agilent Technologies Inc. |
4062 UX |
Parametric Tester |
|
| CSI0016559 |
Agilent Technologies Inc. |
4062C |
Parametric Tester |
|
| CSI0016561 |
Akrion |
Akrion Gama |
ST28, PSR, QDR, SD Dryer |
Solvent 8″ |
| CSI0016562 |
Akrion |
Akrion Gama |
8″ |
|
| CSI0016563 |
AMAT |
Centura-Wxz |
W-CVD |
8″ |
| CSI0016564 |
AMAT |
Centura Polycide AP |
Poly & WSix |
12″ |
| CSI0016565 |
AMAT |
Centura Hart AP |
Deep Trench Etch |
12″ |
| CSI0016566 |
AMAT |
SEM Vision |
Defect Review SEM |
8″ |
| CSI0016567 |
AMAT |
– |
EDSA |
8″ |
| CSI0016568 |
AMAT |
DPS Ⅱ |
Poly Etch |
12″ |
| CSI0016569 |
AMAT |
Stripper |
Poly Etch |
12″ |
| CSI0016570 |
AMAT |
DPSII |
Poly Etch |
|
| CSI0016571 |
AMAT |
eMax CT |
Oxide Etch |
|
| CSI0016572 |
AMAT |
Mirra CMP System |
Poly CMP(Chemical Mechanical Polish) |
|
| CSI0016573 |
AMAT |
Excite |
Particle Counter |
|
| CSI0016574 |
AMAT |
Quantum X |
High Current IMP |
|
| CSI0016576 |
AMAT |
EnduraII |
CVD AL chamber |
|
| CSI0016577 |
AMAT |
Reticle SEM |
Mask CD Measurement |
|
| CSI0016578 |
AMAT |
Hart |
D11 Hart Etch 55c |
|
| CSI0016579 |
AMAT |
P5000 |
8″ |
|
| CSI0016580 |
AMAT Japan |
P5000CVD |
|
|
| CSI0016581 |
Applied |
|
Mechanical arm |
|
| CSI0016582 |
Applied |
Centura Radiance |
Parts |
|
| CSI0016583 |
Applied Materials |
Centura 5200 CxZ |
SACVD (Chemical Vapor Deposition) |
|
| CSI0016584 |
Applied Materials |
Mirra Integra |
Poly/STI CMP |
|
| CSI0016585 |
Applied Materials |
SEMVision CX |
SEM – Defect Review (DR) |
|
| CSI0016586 |
Applied Materials |
Precision Implant xR80 LEAP II |
High Current Implanter |
|
| CSI0016587 |
Applied Materials |
Endura II Chamber: TxZ CVD TiN |
PVD (Physical Vapor Deposition) |
|
| CSI0016588 |
Applied Materials |
VeritySEM 3 |
SEM – Critical Dimension (CD) Measurement |
|
| CSI0016589 |
Applied Materials |
VeritySEM 2 |
SEM – (CD) |
|
| CSI0016590 |
Applied Materials |
Endura II Liner/Barrier |
PVD (Physical Vapor Deposition) |
|
| CSI0016591 |
Applied Materials |
Centura SiNgen Chamber |
LPCVD |
|
| CSI0016592 |
Applied Materials |
Quantum X Plus |
High Current Implanter |
|
| CSI0016593 |
Applied Materials |
SEM Vision Cx |
Defect Review SEM |
|
| CSI0016594 |
ASM |
A400 |
HSG |
|
| CSI0016595 |
ASM |
AD830 |
Die Bonder |
|
| CSI0016596 |
ASM |
AD868 |
Die Bonder |
|
| CSI0016597 |
ASM |
AD898 |
Die Bonder |
|
| CSI0016598 |
ASM |
EAGLE60 |
Wire Bonder |
|
| CSI0016599 |
ASM |
EAGLE60 AP |
Wire Bonder |
|
| CSI0016600 |
ASM |
TWIN EAGLE |
Wire Bonder |
|
| CSI0016601 |
ASM |
Ihawk-xtreme |
Wire Bonder |
|
| CSI0016602 |
ASM |
IS Eagle Xtreme |
Wire Bonder |
|
| CSI0016603 |
ASM |
IBE139 |
Buffer |
|
| CSI0016604 |
ASM |
IBE109 |
|
|
| CSI0016605 |
ASM International |
Eagle-12 Rapidfire |
PECVD (Chemical Vapor Deposition) |
|
| CSI0016606 |
ASM International |
Eagle XP |
PECVD (Chemical Vapor Deposition) |
|
| CSI0016607 |
ASM International |
A412 |
Vertical Atmospheric Furnace |
|
| CSI0016608 |
ASML |
AT-1150C |
193nm ARF Scanner |
12″ |
| CSI0016609 |
ASML |
TWINSCAN XT:1900Gi |
Immersion Scanner |
|
| CSI0016610 |
AST/Mattson |
AST 2800 |
Dual Load Lock single chamber RTP |
RTP 8″ |
| CSI0016611 |
Aviza |
Evolve |
VF LowTEMP SiN |
12″ |
| CSI0016613 |
Axcelis |
Optima MD |
Medium Current IMP |
12″ |
| CSI0016614 |
Axcelis |
Summit XT |
CoSi/NiSi RTA |
|
| CSI0016615 |
Axcelis Technologies Inc. |
8250HT |
Mid Current Implanter |
|
| CSI0016616 |
Axcelis Technologies Inc. |
RapidStrip 320 |
Stripper/Asher |
|
| CSI0016617 |
Axcelis Technologies Inc. |
Integra RS |
Stripper/Asher |
|
| CSI0016618 |
BESI |
Datacon 2200 APM Plus |
Flip Chip Bonder |
|
| CSI0016619 |
Biding/OYFORD/X -Strata |
X-Strata |
|
|
| CSI0016620 |
Bruker |
VX330 |
Depth Measurement (AFM) |
|
| CSI0016621 |
Canon |
ES5 |
DUV Scanner |
8″ |
| CSI0016622 |
Canon |
VIR-650 |
|
|
| CSI0016623 |
Canon |
MPA-600FA |
6 |
|
| CSI0016624 |
Canon |
FPA-2500i3 |
6″ |
|
| CSI0016625 |
Canon |
FPA-5000 ES4 |
248nm (KrF) Scanner |
|
| CSI0016626 |
Canon |
FPA-6000 ES5 |
248nm (KrF) Scanner |
|
| CSI0016627 |
Canon |
FPA-6000 ES6a |
248nm (KrF) Scanner |
|
| CSI0016628 |
Canon |
FPA-6000 ES6 |
248nm (KrF) Scanner |
|
| CSI0016629 |
Canon-ANELVA |
ILD-4100SR |
W Dry Etcher |
8″ |
| CSI0016630 |
Canon-ANELVA |
ILD-4100SDⅡ |
OX Dry Etcher |
8″ |
| CSI0016631 |
Canon-ANELVA |
ILD-4100SR |
OX Dry Etcher |
8″ |
| CSI0016632 |
Credence |
KALOS HEX |
8 sites, 48 I/O per site |
TEST SORT 8″ |
| CSI0016633 |
Credence Systems Corporation |
Kalos HEX |
Memory Tester |
|
| CSI0016634 |
Credence Systems Corporation |
Kalos XW |
Memory Tester |
|
| CSI0016635 |
Credence Systems Corporation |
Kalos XW, EU |
Memory Tester |
|
| CSI0016636 |
DAGE |
dage2400T |
|
|
| CSI0016926 |
Dage |
4000 |
Die Shear Pull Tester |
|
| CSI0016637 |
Ding Technology Co., Ltd. |
Plasma Cleaner (O2 Plasma Strippin) |
|
|
| CSI0016638 |
Disco |
DFG 82IF |
2 SPINDLES |
GRIND 8″ |
| CSI0016639 |
Disco |
DGP8761 |
|
|
| CSI0016640 |
Disco |
DFL7340 |
|
|
| CSI0016641 |
DISCO |
DFL7160 |
Laser Dicing |
|
| CSI0016642 |
DISCO |
DAD321 |
Dicing Saw |
|
| CSI0016643 |
DISCO |
DAD340 |
Dicing Saw |
|
| CSI0016644 |
DISCO |
DAD341 |
Dicing Saw |
|
| CSI0016645 |
DISCO |
DAD3350 |
Dicing Saw |
|
| CSI0016646 |
DISCO |
DAD521 |
Dicing Saw |
|
| CSI0016647 |
DISCO |
DAD522 |
Dicing Saw |
|
| CSI0016648 |
DISCO |
DAD641 |
Dicing Saw |
|
| CSI0016649 |
DISCO |
DAD651 |
Dicing Saw |
|
| CSI0016650 |
DISCO |
DFD641 |
Dicing Saw |
|
| CSI0016651 |
DISCO |
DFD640 |
Dicing Saw |
|
| CSI0016652 |
DISCO |
DFD650 |
Dicing Saw |
|
| CSI0016653 |
DISCO |
DFD651 |
Dicing Saw |
|
| CSI0016654 |
DISCO |
DFD6340+3000D |
Dicing Saw |
|
| CSI0016655 |
DISCO |
DFD6340+3500D |
Dicing Saw |
|
| CSI0016656 |
DISCO |
DFD6361 |
Dicing Saw |
|
| CSI0016657 |
DISCO |
EAD6340 |
Dicing Saw |
|
| CSI0016658 |
DISCO |
DFG841 |
Grinder |
|
| CSI0016659 |
DISCO |
DFG840HS |
Grinder |
|
| CSI0016660 |
DISCO |
DFP8140 |
Grinder |
|
| CSI0016661 |
DISCO CORPORATION |
MOCVD local scrubber |
|
|
| CSI0016662 |
DISCO HI-TEC AMERICA |
DFD6361 |
8″ and 12″ |
|
| CSI0016663 |
DISCO HI-TEC AMERICA |
DFG8540 |
6″ and 8″ |
|
| CSI0016664 |
DNS |
AS2000 |
CMP Oxide(Scrubber) |
8″ |
| CSI0016665 |
DNS |
SD-W80A-A |
Organic strip |
8″ |
| CSI0016666 |
DNS |
FC3000 |
W.S. Oxide Etch |
12″ |
| CSI0016667 |
DNS |
AS-2000 |
Scrubber for CMP |
|
| CSI0016669 |
DNS |
SK-W629-BV |
|
|
| CSI0016670 |
DNS |
SDW-629-BV(P) |
|
|
| CSI0016672 |
Ebara |
FREX300S |
Dielectric CMP |
|
| CSI0016673 |
Electroglas Inc. (EMTS) |
Horizon 4085X |
Production Wafer Prober |
|
| CSI0016674 |
Electroglas Inc. (EMTS) |
Horizon 4090u |
Production Wafer Prober |
|
| CSI0016675 |
ESEC |
2008XP |
Die Bonder |
|
| CSI0016676 |
ESEC |
2008XP3 |
Die Bonder |
|
| CSI0016677 |
ESEC |
3100plus |
Wire Bonder |
|
| CSI0016678 |
ESEC SA |
2008 HS3 Plus |
Die Bonder |
|
| CSI0016679 |
GaSonics International |
Aura 2000 |
Stripper/Asher |
|
| CSI0016680 |
Hanmi semiconductor |
PICK&PLACE-2512 |
|
|
| CSI0016684 |
Hitachi |
9260 |
CD SEM |
|
| CSI0016685 |
Hitachi |
WA200 |
8″ |
|
| CSI0016686 |
Hitachi |
RS3000 |
8″/12 |
|
| CSI0016687 |
Hitachi |
S-4160 |
|
|
| CSI0016688 |
Hitachi |
S-4500 |
|
|
| CSI0016689 |
Hitachi |
4700 (w/EDAX) |
|
|
| CSI0016690 |
Hitachi |
S-4800 |
|
|
| CSI0016691 |
Hitachi |
S-5000 |
|
|
| CSI0016692 |
Hitachi |
S-5200 |
|
|
| CSI0016693 |
Hitachi |
S-5500 |
12″ |
|
| CSI0016694 |
Hitachi |
S-9380 II |
12″ |
|
| CSI0016695 |
Hitachi (Semiconductor) |
RS-6000 |
SEM – Defect Review (DR) |
|
| CSI0016696 |
Hitachi (Semiconductor) |
M511AE |
Polysilicon Etch |
|
| CSI0016697 |
Hitachi (Semiconductor) |
M-712 |
Polysilicon Etch |
|
| CSI0016700 |
JEOL |
JWS-7515 |
Inspection SEM |
|
| CSI0016701 |
JEOL |
JWS-2000 |
|
|
| CSI0016702 |
JEOL |
JWS-7555 |
SEM – Defect Review (DR) |
|
| CSI0016924 |
K&S |
IConn |
Wire Bonder (REFURBIHED ) QUANTITY X 4 |
|
| CSI0016925 |
K&S |
IConn PLUS |
Wire Bonder (REFURBIHED ) QUANTITY X 4 |
|
| CSI0016703 |
Karl Suss |
MA150 |
|
|
| CSI0016705 |
KLA Tencor |
AIT-UV |
8″ |
|
| CSI0016706 |
KLA Tencor |
ARCHER 100AIM |
12″ |
|
| CSI0016707 |
KLA Tencor |
ARCHER 10XT |
12″ |
|
| CSI0016708 |
KLA Tencor |
KLA 2810 |
12″ |
|
| CSI0016709 |
KLA Tencor |
P-20H |
8″ |
|
| CSI0016710 |
KLA Tencor |
PUMA 9000D |
8″ |
|
| CSI0016711 |
KLA Tencor |
PUMA 9000D |
12″ |
|
| CSI0016712 |
KLA Tencor |
SP1 TBI |
8″ |
|
| CSI0016713 |
KLA Tencor |
SP3 |
12″ |
|
| CSI0016714 |
KLA Tencor |
9130 |
12″ |
|
| CSI0016715 |
KLA Tencor |
2810 |
12″ |
|
| CSI0016716 |
KLA Tencor |
2139 |
8 |
|
| CSI0016717 |
KLA/TENCOR |
AIT II |
DFI Inspection |
8″ |
| CSI0016718 |
KLA-Tencor |
ECD2 |
CD SEM |
12″ |
| CSI0016719 |
KLA-Tencor |
Viper 2430 |
ADI |
12″ |
| CSI0016720 |
KLA-Tencor |
Viper 2435 |
ADI |
12″ |
| CSI0016722 |
KLA-Tencor |
eS25 |
e-Beam Inspection |
|
| CSI0016723 |
KLA-Tencor |
FLX-2908 |
8″ |
|
| CSI0016724 |
KLA-Tencor |
KLA AMRAY 4200 |
Inspection System |
SEM 8″ |
| CSI0016725 |
KLA-Tencor |
Candela CS20 |
|
|
| CSI0016726 |
KLA-Tencor |
SFS7600（249505） |
|
|
| CSI0016727 |
KLA-TENCOR |
6420 (289108) |
150mm & 200mm |
|
| CSI0016728 |
KLA-TENCOR |
HRP220 |
200mm |
|
| CSI0016729 |
KLA-Tencor Corp. |
Surfscan SP2 |
Particle Measurement |
|
| CSI0016730 |
KLA-Tencor Corp. |
Viper 2410 |
Macro-Defect |
|
| CSI0016731 |
KLA-Tencor Corp. |
Surfscan SP2 XP |
Particle Measurement |
|
| CSI0016732 |
KLA-Tencor Corp. |
Archer 100 |
Overlay Measurement System |
|
| CSI0016733 |
KLA-Tencor Corp. |
Archer 300 |
Overlay Measurement System |
|
| CSI0016734 |
KLA-Tencor Corp. |
2820 |
Wafer Inspection Equipment |
|
| CSI0016735 |
KNS |
Maxum plus |
Wire Bonder |
|
| CSI0016736 |
Kokusai Electric Co., Ltd. |
Vertron III Anneal |
Vertical Anneal Furnace |
|
| CSI0016737 |
Kokusai Electric Co., Ltd. |
Vertron-III Oxide |
Vertical LPCVD Furnace |
|
| CSI0016738 |
Kokusai Electric Co., Ltd. |
Vertron-III Nitride |
Vertical LPCVD Furnace |
|
| CSI0016739 |
Kokusai Electric Co., Ltd. |
Quixace Ultimate ALD SiO2 |
Vertical Diffusion Furnace |
|
| CSI0016740 |
Kokusai Electric Co., Ltd. |
Quixace Nitride |
Vertical LPCVD Furnace |
|
| CSI0016741 |
Kokusai Electric Co., Ltd. |
Quixace Ultimate ALD TiN |
Vertical LPCVD Furnace |
|
| CSI0016742 |
Kokusai Electric Co., Ltd. |
Quixace II Doped Poly |
Vertical LPCVD Furnace |
|
| CSI0016743 |
Kokusai Electric Co., Ltd. |
Quixace II Nitride |
Vertical LPCVD Furnace |
|
| CSI0016744 |
Kokusai Electric Co., Ltd. |
Quixace Doped Poly |
Vertical LPCVD Furnace |
|
| CSI0016745 |
Kokusai Electric Co., Ltd. |
Quixace II TEOS |
Vertical LPCVD Furnace |
|
| CSI0016746 |
Kokusai Electric Co., Ltd. |
Quixace II ALD Nitride |
Vertical LPCVD Furnace |
|
| CSI0016747 |
Lam |
SP304 |
Parts |
|
| CSI0016748 |
LAM Research |
2300 Versys Star |
Polysilicon Etch |
|
| CSI0016749 |
LAM Research |
Rainbow 4520i |
Dielectric Etch |
|
| CSI0016750 |
LAM Research |
Rainbow 4420 |
Polysilicon Etch |
|
| CSI0016751 |
LAM Research |
2300 Exelan Flex 45 |
Dielectric Etch |
|
| CSI0016752 |
LAM Research |
2300 Exelan Flex EX |
Dielectric Etch |
|
| CSI0016753 |
LAM Research |
2300 Exelan Flex EX+ |
Dielectric Etch |
|
| CSI0016754 |
LAM Research |
2300 Versys Metal |
Metal Etch |
|
| CSI0016755 |
LAM Research |
2300 Exelan Flex |
Dielectric Etch |
|
| CSI0016756 |
Leica |
INS-3300G1 |
ACI (Manual) |
12″ |
| CSI0016757 |
Leica |
INS-3300+DUV |
ADI |
|
| CSI0016927 |
Leica |
INM100 |
Inspection Microscope with monitor |
8″ |
| CSI0016758 |
Leica Inc. |
INS3000 |
Macro-Defect |
|
| CSI0016759 |
Leica INS300 Defect Inspection Statio |
|
|
|
| CSI0016760 |
LINTEC |
RAD-2500F/12 |
Tape Laminator |
|
| CSI0016761 |
LINTEC |
RAD-2000,m/8 |
UV irradiation machine |
|
| CSI0016762 |
MARCH PLASMA |
|
|
|
| CSI0016763 |
Mattson Technology, Inc. |
Aspen III ICPHT |
Stripper/Asher |
|
| CSI0016764 |
Mattson Technology, Inc. |
Helios |
Standalone RTP Equipment |
|
| CSI0016765 |
Mirae |
MR9220 |
|
|
| CSI0016766 |
Mirae |
M820 |
|
|
| CSI0016767 |
MJB4 exposure machine |
|
|
|
| CSI0016768 |
Nanometrics |
M6100 |
Nanospec/AFT M6100 |
Film Thickness 8″ |
| CSI0016769 |
Nanometrics Inc. |
LYNX |
Critical Dimension (CD) Measurement (non SEM) |
|
| CSI0016770 |
Nikon |
NSR-2205EX14C |
KrF Stepper |
|
| CSI0016771 |
Nikon |
NSR-2205i11D |
I-Line Stepper |
|
| CSI0016772 |
Nikon |
NSR-2205EX12B |
KrF Stepper |
|
| CSI0016773 |
Nikon |
NWL-860 |
OM inspection |
|
| CSI0016774 |
NIKON |
NSR-1755i7B |
|
|
| CSI0016775 |
NIKON |
SMZ800 |
|
|
| CSI0016777 |
Nikon |
OPTIPHOT-88-AC |
8″ |
|
| CSI0016778 |
Nikon |
OPTIPHOT-88-AC IN |
8″ |
|
| CSI0016779 |
Nikon |
NSR-1505G6E |
5″ |
|
| CSI0016780 |
Nikon |
NSR-1505G6E |
6″ |
|
| CSI0016781 |
Nikon |
NSR-1755i7A |
6″ |
|
| CSI0016782 |
Nikon |
NSR-1755i7B |
6″ |
|
| CSI0016783 |
Nikon |
NSR-4425i |
6″ |
|
| CSI0016784 |
Nikon |
NSR-2005i8A |
4 |
|
| CSI0016785 |
Nikon |
NSR-2005i9C |
6 |
|
| CSI0016786 |
Nikon |
NSR-2005i10C |
4 |
|
| CSI0016787 |
Nikon |
NSR-2005i9C |
i-Line Stepper |
|
| CSI0016788 |
Nikon |
NSR-S204B |
248nm (KrF) Scanner |
|
| CSI0016789 |
NISIN ION EQUIPMENT |
EXCEED2000 |
Middle current Implanter |
|
| CSI0016790 |
NISIN ION EQUIPMENT |
EXCEED2000A |
Middle current Implanter |
|
| CSI0016791 |
Nissin Electric Co., Ltd. |
EXCEED 2300 |
Mid Current Implanter |
|
| CSI0016792 |
Nissin Electric Co., Ltd. |
Exceed 2300AV |
Mid Current Implanter |
|
| CSI0016793 |
NITTO |
HR8500II |
|
|
| CSI0016794 |
NITTO |
MA-3000II |
Tape Laminator |
|
| CSI0016795 |
Nova Measuring Instruments, Inc. |
NovaScan 3060 SA |
Critical Dimension (CD) Measurement (non SEM) |
|
| CSI0016796 |
Nova Measuring Instruments, Inc. |
NovaScan 3090 Next SA |
Critical Dimension (CD) Measurement (non SEM) |
|
| CSI0016797 |
Novellus Systems Inc. |
Concept Two-Dual Sequel-S |
PECVD (Chemical Vapor Deposition) |
|
| CSI0016798 |
Novellus Systems Inc. |
Concept Two-Dual Altus-S |
WCVD (Chemical Vapor Deposition) |
|
| CSI0016799 |
Novellus Systems Inc. |
Concept Two-Single Sequel |
PECVD (Chemical Vapor Deposition) |
|
| CSI0016800 |
Novellus Systems Inc. |
Concept Two-Triple Speed-S |
HDP CVD (Chemical Vapor Deposition) |
|
| CSI0016801 |
Novellus Systems Inc. |
VECTOR Express |
PECVD (Chemical Vapor Deposition) |
|
| CSI0016802 |
Novellus Systems Inc. |
Concept Three Speed |
HDP CVD (Chemical Vapor Deposition) |
|
| CSI0016804 |
OKAMOTO |
GNX200 |
Grinder |
|
| CSI0016805 |
OnTrak Systems, Inc. |
DSS-200 Series II |
Wafer Scrubber – Post CMP |
|
| CSI0016806 |
ORTHODYNE ELECTRONICS |
7200 Plus |
Wire Bonder |
|
| CSI0016923 |
ORTHODYNE ELECTRONICS |
M360C |
Heavy Wire Bonder & optional small wire kits |
|
| CSI0016807 |
OXFORD INSTRUMENTS PLASMA |
Chemical vapor deposition system -133 PECVD # 5 (STK034413) (none) |
(No) |
|
| CSI0016809 |
Qualitau |
MIRA |
EM Tester |
|
| CSI0016810 |
RENESAS |
CM-700 |
Die Bonder |
|
| CSI0016811 |
Rigaku |
NTX-200 |
|
|
| CSI0016812 |
RUDOLPH |
METAPULSE 200 |
ADHESION THICKNESS |
8″ |
| CSI0016813 |
Rudolph Technologies, Inc. |
MetaPULSE 300 |
Film Thickness Measurement System |
|
| CSI0016814 |
Rudolph Technologies, Inc. |
NSX 105 |
Macro-Defect |
|
| CSI0016815 |
Rudolph Technologies, Inc. |
Axi 930 |
Macro-Defect |
|
| CSI0016816 |
SCREEN |
SU3000 |
Backside Etch |
|
| CSI0016817 |
SEMITool |
Raider |
PR Strip (ST250) |
12″ |
| CSI0016818 |
SEN |
NV-GSD-HE |
High energy IMPLA |
|
| CSI0016819 |
SET (Suss Microtec) |
FC300 |
Flip Chip Bonder |
|
| CSI0016820 |
Shibaura |
CDE-300 |
Light Etch |
12″ |
| CSI0016821 |
Shibaura Engineering Works Ltd. |
CDE-300 |
Metal Etch |
|
| CSI0016822 |
Shinkawa |
SPA300 |
Die Bonder |
|
| CSI0016823 |
Shinkawa |
SPA400 |
Die Bonder |
|
| CSI0016824 |
Shinkawa |
SPA300SUPER |
Die Bonder |
|
| CSI0016825 |
SHINKAWA |
UTC2000 |
Wire Bonder |
|
| CSI0016826 |
SMARTSCOPE |
SMARTSCOPE MVP300 |
Cleaning System |
|
| CSI0016829 |
SOTER (ASM) |
|
|
|
| CSI0016830 |
Sumitomo Electronics |
RS-35C |
|
|
| CSI0016833 |
SUSS MICROTEC |
ACS200 PLUS |
200mm |
|
| CSI0016834 |
SUSS MICROTEC LITHOGRAPHY GMBH |
Model 3300-FC-02 Single Wafer Flux Clean |
|
|
| CSI0016835 |
SVG Track Division |
90S |
Linear Wafer Tracks (Resist Coater/Developer) |
|
| CSI0016836 |
TAKATORI |
ATRM-2200 |
|
|
| CSI0016838 |
Tegal |
TEGAL 981 |
Single chamber silicon nitride etcher |
Nitride Etch 8″ |
| CSI0016839 |
TEL |
α-808SC |
LP-DOPOS(L/L) |
8″ |
| CSI0016840 |
TEL |
CLEAN TRACK MARK-8 |
Resist Coater |
8″ |
| CSI0016841 |
TEL |
CLEAN TRACK MARK-8 |
inline Developper |
8″ |
| CSI0016842 |
TEL |
UNITY 2 |
VIA Etch(Cu) |
8″ |
| CSI0016843 |
TEL |
Alpha-8S-ZAR |
Cu line AP Alloy |
8″ |
| CSI0016844 |
TEL |
Alpha-8S-ZV |
Cu line AP Alloy |
8″ |
| CSI0016845 |
TEL |
Alpha-8S-ZAN |
VF Field Oxide |
8″ |
| CSI0016846 |
TEL |
Alpha-8S-ZAR |
VF PAD OX |
8″ |
| CSI0016847 |
TEL |
Alpha-8S-ZVN |
VF LPCVD AA Nitride |
8″ |
| CSI0016848 |
TEL |
Alpha-8S |
VF LPCVD TEOS |
8″ |
| CSI0016849 |
TEL |
Alpha-8S-ZVN |
VF LPCVD Poly-Undoped |
8″ |
| CSI0016850 |
TEL |
Alpha-8S |
VF LPCVD Poly-Undoped |
8″ |
| CSI0016851 |
TEL |
Alpha-8S-ZVF |
VF LPCVD Poly-Undoped |
8″ |
| CSI0016852 |
TEL |
Trias |
CVD Ta2O5 |
12″ |
| CSI0016853 |
TEL |
P8-XL |
Prober |
|
| CSI0016854 |
TEL |
MB2 |
Wsi-CVD |
|
| CSI0016855 |
TEL |
α-8SE |
LP-CVD(Nitride) |
|
| CSI0016856 |
TEL |
Alpha-303i |
VF Gate Oxide |
|
| CSI0016857 |
TEL |
TE-8500PATC |
|
|
| CSI0016858 |
TEL |
P-8XL |
|
|
| CSI0016859 |
TEL |
P-12XL |
|
|
| CSI0016860 |
TEL |
P-12XLn |
|
|
| CSI0016861 |
TEL |
P-12XLn+ |
|
|
| CSI0016862 |
TENCOR |
RS75 |
150mm & 200mm |
|
| CSI0016864 |
Teradyne |
A585 |
184 pin, 20MHz |
TEST SORT 8″ |
| CSI0016865 |
Teradyne |
A585 |
184 pin, 50MHz |
TEST SORT 8″ |
| CSI0016866 |
Therma-Wave |
OP-2600 |
Thickness Measurement |
8″ |
| CSI0016867 |
Therma-Wave Inc. |
Opti-Probe 2600B |
Film Thickness Measurement System |
|
| CSI0016869 |
TOKYO |
A-WD-10A |
Dicing Saw |
|
| CSI0016870 |
TOKYO |
PG200 |
Grinder |
|
| CSI0016871 |
TOKYO |
PG200RM |
Grinder |
|
| CSI0016872 |
TOKYO ELECTRON |
ACT 8 |
8″ |
|
| CSI0016873 |
TOKYO ELECTRON |
MARK 8 |
200mm |
|
| CSI0016874 |
TOKYO ELECTRON |
MARK 8 |
150mm |
|
| CSI0016875 |
TOKYO ELECTRON |
ALPHA 8SE |
8″ |
|
| CSI0016877 |
Tokyo Electron Ltd. |
TELFORMULA Nitride |
Vertical LPCVD Furnace |
|
| CSI0016878 |
Tokyo Electron Ltd. |
TELINDY Plus ALD High-K |
Vertical Furnace – Other |
|
| CSI0016879 |
Tokyo Electron Ltd. |
Telius 305 SCCM |
Dielectric Etch |
|
| CSI0016880 |
Tokyo Electron Ltd. |
TELFORMULA ALD High-K |
Vertical LPCVD Furnace |
|
| CSI0016881 |
Tokyo Electron Ltd. |
Trias W |
MOCVD |
|
| CSI0016882 |
Tokyo Electron Ltd. |
Trias Ti/TiN |
Metal CVD (Chemical Vapor Deposition) |
|
| CSI0016883 |
Tokyo Electron Ltd. |
Telius SP-305 SCCM |
Dielectric Etch |
|
| CSI0016884 |
Tokyo Electron Ltd. |
UNITY Me 85 TD |
Dielectric Etch |
|
| CSI0016885 |
Tokyo Electron Ltd. |
UNITY II 85DD |
Dielectric Etch |
|
| CSI0016886 |
Tokyo Electron Ltd. |
CLEAN TRACK ACT 12 |
Multi Block (Resist Coater/Developer) |
|
| CSI0016887 |
Tokyo Electron Ltd. |
CLEAN TRACK LITHIUS |
Multi Block (Resist Coater/Developer) |
|
| CSI0016888 |
Tokyo Electron Ltd. |
TELINDY ALD High-K |
Vertical LPCVD Furnace |
|
| CSI0016889 |
Tokyo Electron Ltd. |
TELINDY Oxide |
Vertical LPCVD Furnace |
|
| CSI0016890 |
Tokyo Electron Ltd. |
CLEAN TRACK LITHIUS i+ |
Multi Block (Resist Coater/Developer) |
|
| CSI0016891 |
Tokyo Electron Ltd. |
Tactras Vigus |
Dielectric Etch |
|
| CSI0016892 |
Tokyo Electron Ltd. |
NEXX Apollo |
Sputtering System |
|
| CSI0016893 |
Tokyo Electron Ltd. |
Triase+ Ti/TiN |
Metal CVD (Chemical Vapor Deposition) |
|
| CSI0016894 |
Tokyo Electron Ltd. (TEL) |
P-12XL |
Production Wafer Prober |
|
| CSI0016895 |
Tokyo Electron Ltd. (TEL) |
P-12XLm |
Production Wafer Prober |
|
| CSI0016896 |
Tokyo Electron Ltd. (TEL) |
ALPHA-303i Nitride |
Vertical Nitride Furnace |
|
| CSI0016897 |
TOKYO SEIMITSU |
AWD-250S |
Dicing Saw |
|
| CSI0016898 |
TOKYO SEIMITSU CO., LTD |
UF200 |
TSK UF200 8 “wafer Auto Prober System |
|
| CSI0016899 |
TOKYO SEIMITSU CO.,LTD |
UF200 |
Prober |
|
| CSI0016900 |
TOKYO SEIMITSU CO.,LTD |
UF3000 |
Prober |
|
| CSI0016901 |
TOWA |
Y1E-2060 |
Molding |
|
| CSI0016902 |
TOWA |
|
Molding |
|
| CSI0016903 |
TOWA |
LCM1010 |
|
|
| CSI0016905 |
TSK |
UF-200 |
|
|
| CSI0016906 |
TSK |
UF-190B |
|
|
| CSI0016907 |
TSK |
AWD-208T |
Dicing Saw |
|
| CSI0016908 |
TSK |
AWD-300T |
Dicing Saw |
|
| CSI0016921 |
Ultratech |
2244i |
I Line Stepper |
6″ |
| CSI0016922 |
Ultratech |
1700 |
Stepper |
6″ |
| CSI0016909 |
Ulvac Corporation |
Entron-EX |
PVD (Physical Vapor Deposition) |
|
| CSI0016910 |
Ulvac Corporation |
Entron-EX W300 |
PVD (Physical Vapor Deposition) |
|
| CSI0016911 |
ULVAC, INC. |
MOCVD machine TSSEL – (1F) |
19 * 2 “TSSEL |
|
| CSI0016912 |
Varian |
VIISta810 |
Medium Current IMP |
8″ |
| CSI0016913 |
Veeco |
D9000 |
8″ |
|
| CSI0016914 |
Verigy (Agilent) |
V1200 |
Memory Tester |
|
| CSI0016915 |
Verigy (Agilent) |
V3300 |
Memory Tester |
|
| CSI0016916 |
Verigy (Agilent) |
V5400 |
Memory Tester |
|
| CSI0016918 |
Wire testing machine (ROYCE) |
|
|
|
| CSI0016920 |
Zeiss / Olympus |
Axiotron / AL100-LMB8 |
8″ |
|
