Orthodyne Electronics Model M360C Rotary Head Large Wire Bonder
Bond Type: Ultrasonic Wedge
Wire Size and Type: 4 to 20 mils (100 to 500 microns) aluminum. (4 mil (100 micron) wire with front cut only). Also, 25 mil (625 micron) can be used with an optional kit – not included. Small wire kit can be sought if required also.
Wire Bond Area: 250 mm x 150 mm (10″ x 6″)
Microscope: Nikon SMZ660 Stereo Zoom
Maximum Wires per Device: approximately 1, 500 two-bond wires
Bond Angle: ±45° from loop direction. Dependent on loop height.
Bond Head Rotation: ±200°
X-Y Resolution: 0.12 mil (3.125 microns)
Bonds to almost any electronic package requiring 100-500 micron (4-20 mil) wire.
Orthodyne gray-scale pattern recognition system gives higher yield and throughput rates.
Enhanced process control features can be individually modified for each bond.
Four-axis head allows bonding in any direction, to any type of module, leadframe or hybrid substrate.
Low maintenance bond head with no pivot bearing or solenoids to bind or wear.
Shaft encoders on all four motion axes for a completely closed-loop positioning system.
Small footprint and removable work platform for easy handler integration.
Programmable bonding parameters for each bond produce better bond quality and reliability.
Power Requirements: 95-264 VAC, 50-60 Hz, 700 W
Serial Number: 9612002
This machine is in excellent shape and was extremely well maintained. Service was done regularly on this machine. Machine is removed from a working facility and was working when disconnected in October 2016.