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View cart “EKSPLA NT342A 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung” has been added to your cart.
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  • Electroglas 1034 XA6

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  • Die Bonder ESEC 2006

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  • Orthodyne Bonding head for all model 360’s, drawing, kit 2 mil option, rev. A

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  • Hughes 2460-II hybrid bonder, 4“x4“

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  • F&K Delvotek 6830 Wire Bonder

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  • F&K Delvotek 6110 bonder

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  • ESEC 3006 F/X bonders

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  • ESEC 2005 Pi die bonder

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  • ESEC 2004 auto die bonders

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  • Lintec RAD-2500/F Wafer Mounter

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  • Palomar 3500-111 Die Bonder

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  • Hughes/Palomar 8000 Bonder

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  • Disco DFD 6340 Dicing Saw

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  • Orthodyne 3600 Heavy Wire Bonder

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  • Wire Bonder

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Page 40 of 41«‹38394041›

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