VERTICAL 200 coater and developer as well as single wafer process, puddle or dispense process and spray process
SINGLE WAFER SPRAY SOLVENT PROCESSOR
Metal Lift Off
Polymer Removal Megasonic/High Pressure Clean
The process head on the Siconnex Vertical 200 platform is especially designed to run solvent applications such as Metal Lift Off, Resist Strip and Polymer Removal. The Substrate Face- Down Technology eliminates the risk of wafer contamination. Dry wafer handling throughout the system minimizes maintenance. Up to 6 process modules are arranged in a stacked chamber design, keeping the footprint (with integrated chemical conditioning system) smaller than 4m2. Based on this configuration a typical Lift-Off application achieves a throughput of 125wph.
Wafer sizes up to 4-inch are processed in this system.
InSitu Lift-Off Chamber
Compared to other available systems on the market, the Siconnex Vertical 200 SOLVENT has an on the Siconnex Vertical 200 platform enabling the tool to perform both steps in one chamber, a complete soaking process as well as the final High-Pressure Lift-Off cycle. The soaking step is done by utilizing
dedicated spray nozzles, up to a pressure of approximately 2 bar. Using the mechanical force of this stream, the soaking time can be reduced by over 75%. The subsequent High-Pressure step eliminates residues and cleans the surface completely. The required pressure (up to 150 bar) can be adjusted in the recipe.
Substrate Face-Down Technology
Wafers are loaded face-down into the process chamber, where they are held by a vacuum chuck. A N2-Purge completely protects the wafer backside from splash-backs caused by the high pressure step.
Due to Substrate Face-Down Technology, all residues will be kept away from the wafer surface by gravity. In addition, this technology prevents the wafer from scratches caused by metal residues.